Book of Donmon Teith

Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in inte

This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to mas

The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerati

MCMs are electronic components that house multiple integrated circuits (ICs) upon a single chip. Their use in design allow systems that are faster, hotter and m

Advantages of MCMs over traditional packaging methods for electronic-based applications in computers, aviation, and the military. Introduction to Multichip Modu